Inventor · Boise, ID, US

Benjamin L. McClain

19Patents
3h-index
9Co-inventors
45Inventor score

Filing activity: May 23, 2017 → Aug 4, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10276539B1 Method for 3D ink jet TCB interconnect control Electricity 4 Active
US10548230B2 Method for stress reduction in semiconductor package via carrier Electricity 3 Active
US10950568B2 Semiconductor device assembly with surface-mount die support structures Electricity 3 Active
US10090177B1 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Emerging Cross-Sectional Technologies 3 Active
US10952333B2 Method for stress reduction in semiconductor package via carrier Electricity 2 Active
US10840209B2 Methods and systems for manufacturing semiconductor devices Electricity 2 Active
US10840210B2 Methods and systems for manufacturing semiconductor devices Electricity 2 Active
US10410891B2 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Emerging Cross-Sectional Technologies 1 Active
US11594432B2 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Emerging Cross-Sectional Technologies 1 Active
US11410962B2 Methods and systems for manufacturing semiconductor devices Electricity 1 Active
US12080678B2 Methods and systems for manufacturing semiconductor devices Electricity 0 Active
US11670612B2 Method for solder bridging elimination for bulk solder C2S interconnects Electricity 0 Active
US10700038B2 Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool Electricity 0 Active
US10998208B2 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Emerging Cross-Sectional Technologies 0 Active
US11410963B2 Methods and systems for manufacturing semiconductor devices Electricity 0 Active
US10879195B2 Method for substrate moisture NCF voiding elimination Electricity 0 Active
US11705425B2 Thermocompression bond tips and related apparatus and methods Electricity 0 Active
US12087720B2 Semiconductor device assembly with surface-mount die support structures Electricity 0 Active
US11024595B2 Thermocompression bond tips and related apparatus and methods Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.