Micropillar-enabled thermal ground plane

US11598594B2 · kind B2 · utility

Assignee

• The Regents of the University of Colorado · US

Inventors

• Ryan John Lewis · Boulder, US
• Li-Anne Liew · Westminster, US
• Ching-Yi Lin · New York, US
• Collin Jennings Coolidge · Erie, US
• Shanshan Xu · Beijing, CN
• Ronggui Yang · New York, US
• Yung-Cheng Lee · Boulder, US

Key dates

• Filing date: May 12, 2020
• Grant date: Mar 7, 2023
• Expiry date: May 12, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/3736
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.