Physical vapor deposition system and processes
US11599016B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jan 18, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.