Photoresist compositions and methods for fabricating semiconductor devices using the same
US11599021B2 · kind B2 · utility
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24References
8Claims
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Key dates
| Filing date | May 4, 2022 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | May 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.