Substrate cleaning method, substrate cleaning system, and storage medium
US11600499B2 · kind B2 · utility
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8Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 13, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate cleaning method according to an aspect of the present disclosure includes: supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate; supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component; and supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.