Semiconductor chip bonding apparatus including head having thermally conductive materials
US11607741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Jul 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.