Jonggu LEE
5Patents
1h-index
18Co-inventors
40Inventor score
Filing activity: Mar 30, 2016 → May 23, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11607741B2 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Electricity | 1 | Active |
| US12298676B2 | Substrate processing apparatus | Electricity | 0 | Active |
| US11626381B2 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Electricity | 0 | Active |
| US10448323B2 | Node unit of distributed antenna system | Electricity | 0 | Active |
| US11848301B2 | Method of manufacturing a semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.