Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines
US11609183B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Dec 17, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/127
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.