Heat transfer for power modules
US11610832B2 · kind B2 · utility
0Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.