Substrate processing apparatus and substrate processing method
US11612017B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Jul 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a substrate processing apparatus, including: a substrate holding/rotating part configured to hold a substrate on a mounting table and rotate the substrate; a laser irradiation head configured to irradiate a laser beam toward a lower surface of the mounting table; and a controller configured to control at least the rotation of the substrate holding/rotating part and the irradiation of the laser beam. The laser irradiation head is fixed below the mounting table so as to be spaced apart from the mounting table. The controller controls the laser irradiation head to irradiate the laser beam when the mounting table is rotated by the substrate holding/rotating part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.