Semiconductor package with heatsink
US11616006B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | May 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of the substrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.