Integrated circuit with radio frequency interconnect
US11616631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Aug 20, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/70
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a first through fourth devices positioned over a substrate, the first device including first through third transceivers, the second device including a fourth transceiver, the third device including a fifth transceiver, and the fourth device including a sixth transceiver. A first radio frequency interconnect (RFI) includes the first transceiver coupled to the fourth transceiver through a first guided transmission medium, a second RFI includes the second transceiver coupled to the fifth transceiver through a second guided transmission medium, and a third RFI includes the third transceiver coupled to the sixth transceiver by the second guided transmission medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.