Wire for electric bonding
US11618109B2 · kind B2 · utility
0Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2021 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/406
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.