Chanmi Lee
8Patents
2h-index
11Co-inventors
40Inventor score
Filing activity: Jan 13, 2017 → May 31, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9997521B2 | Semiconductor devices | Electricity | 4 | Active |
| US10573651B2 | Semiconductor devices | Electricity | 4 | Active |
| US10396083B2 | Semiconductor devices | Electricity | 2 | Active |
| US10153283B2 | Semiconductor devices including conductive contacts and insulation patterns arranged in an alternating sequence and methods of fabricating the same | Electricity | 1 | Active |
| US12349505B2 | Method of manufacturing electric device | Electricity | 0 | Active |
| US11677060B2 | Method for transferring and bonding of devices | Electricity | 0 | Active |
| US11618109B2 | Wire for electric bonding | Performing Operations; Transporting | 0 | Active |
| US12206056B2 | Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.