Methods of fabricating leadless power amplifier packages including topside terminations
US11621231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2022 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Apr 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Leadless power amplifier (PA) packages and methods for fabricating leadless PA packages having topside terminations are disclosed. In embodiments, the method includes providing electrically-conductive pillar supports and a base flange. At least a first radio frequency (RF) power die is attached to a die mount surface of the base flange and electrically interconnected with the pillar supports. Pillar contacts are further provided, with the pillar contacts electrically coupled to the pillar supports and projecting therefrom in a package height direction. The first RF power die is enclosed in a package body, which at least partially defines a package topside surface opposite a lower surface of the base flange. Topside input/out terminals are formed, which are accessible from the package topside surface and which are electrically interconnected with the first RF power die through the pillar contacts and the pillar supports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.