Yun Wei
13Patents
1h-index
35Co-inventors
50Inventor score
Filing activity: Mar 18, 2013 → Apr 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8803234B1 | High voltage semiconductor device and method for fabricating the same | Electricity | 12 | Active |
| US11342275B2 | Leadless power amplifier packages including topside terminations and methods for the fabrication thereof | Electricity | 1 | Active |
| US11984429B2 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Electricity | 1 | Active |
| US11349438B2 | Power amplifier packages containing multi-path integrated passive devices | Electricity | 0 | Active |
| US10770555B2 | Semiconductor device and method for forming the same | Electricity | 0 | Active |
| US10572070B2 | Optical devices and fabrication method thereof | Physics | 0 | Active |
| US12400883B2 | Structure of transferring dies for use in mass transferring process | Electricity | 0 | Active |
| US10389117B2 | Dynamic modeling and resilience for power distribution | Emerging Cross-Sectional Technologies | 0 | Active |
| US10395085B2 | Semiconductor device and fingerprint sensor device thereof | Electricity | 0 | Active |
| US10608588B2 | Amplifiers and related integrated circuits | Electricity | 0 | Active |
| US11621231B2 | Methods of fabricating leadless power amplifier packages including topside terminations | Electricity | 0 | Active |
| US10147636B2 | Methods for fabricating trench isolation structure | Electricity | 0 | Active |
| US10680120B2 | Semiconductor device and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.