Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
US11626316B2 · kind B2 · utility
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Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | May 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems for filling a recess on a surface of a substrate with carbon-containing material are disclosed. Exemplary methods include forming a first carbon layer within the recess, etching a portion of the first carbon layer within the recess, and forming a second carbon layer within the recess. Structures formed using the method or system are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.