Steam cleaning of CMP components

US11628478B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Haosheng Wu · San Jose, US
• Jianshe Tang · San Jose, US
• Hari Soundararajan · Sunnyvale, US
• Shou-Sung Chang · Mountain View, US
• Hui Chen · Burlingame, US
• Chih Chung Chou · San Jose, US
• Alexander John Fisher · Santa Clara, US
• Paul D. Butterfield · San Jose, US

Key dates

• Filing date: May 28, 2020
• Grant date: Apr 18, 2023
• Expiry date: May 28, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.