Titanium dioxide containing ruthenium chemical mechanical polishing slurry
US11629271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Aug 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition for polishing a ruthenium containing substrate comprises, consists of, or consists essentially of a water based liquid carrier; titanium oxide particles dispersed in the liquid carrier, the titanium oxide particles including rutile and anatase such that an x-ray diffraction pattern of the titanium oxide particles has a ratio X:Y greater than about 0.05, wherein X represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.24 Å and Y represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.51 Å; and a pH in a range from about 7 to about 10. Optional embodiments further include a pH buffer having a pKa in a range from about 6 to about 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.