Electrochemical depositions of ruthenium-containing materials
US11629423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Aug 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53252
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary methods of electroplating may include providing a patterned substrate having at least one opening, where the opening includes one or more sidewalls and a bottom surface. The methods may also include plating a first portion of ruthenium-containing material on the bottom surface of the opening at a first deposition rate and a second portion of ruthenium-containing material on the sidewalls of the opening at a second deposition rate, where the first deposition rate is greater than the second deposition rate. The methods may be used to make integrated circuit devices that include void-free, electrically-conductive lines and columns of ruthenium-containing materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.