Patent · US Active

Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same

US11631628B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Neugirg · Regensburg, DE
Peter Scherl · Regensburg, DE

Key dates

Filing date	Feb 26, 2021
Grant date	Apr 18, 2023
Priority date	—
Expiry date	Apr 12, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip package is provided with improved connections between different components within the package. The semiconductor chip package may comprise a semiconductor chip disposed on a substrate. The semiconductor chip may have a first surface and a second surface. The first surface of the semiconductor chip may be connected to the substrate. The semiconductor chip package may comprise a leadframe that includes a first lead and a second lead. The first lead of the leadframe may be directly attached to the second surface of the semiconductor chip. The second lead of the leadframe may be directly attached to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.