Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method
US11631653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2018 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.