Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer
US11635691B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2020 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Sep 9, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2365/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W1; and W2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.