Patent · US Active

Method and apparatus for use in wafer processing

US11637028B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Fischer · Umkirch, DE
Gerald Lackner · Arnoldstein, AT
Walter Leitgeb · Wernberg, AT
Michael Lecher · Villach, AT

Key dates

Filing date	Mar 31, 2021
Grant date	Apr 25, 2023
Priority date	—
Expiry date	Mar 31, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67092
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.