Apparatus for electrochemically processing semiconductor substrates
US11643744B2 · kind B2 · utility
0Cited by
6References
19Claims
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Key dates
| Filing date | Jun 24, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a semiconductor wafer is provided. The method includes introducing the wafer to a main chamber via a loading port, using a transfer mechanism to transfer the wafer to a first wafer processing module in a stack so that the wafer is disposed substantially horizontally in the first wafer processing module with a front face facing upwards, and performing a processing step on the front face of the wafer in the first wafer processing module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.