Substrate support assembly with arc resistant coolant conduit
US11646183B2 · kind B2 · utility
1Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Aug 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.