Patterning of thin film capacitors in organic substrate packages
US11651902B2 · kind B2 · utility
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3References
17Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 29, 2018 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jul 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.