High current device testing apparatus and systems
US11656273B1 · kind B1 · utility
0Cited by
56References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Nov 5, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.