Apparatus for treating substrate
US11656557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Nov 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate includes a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an air flow guide duct guiding a flow direction of an air flow flowing on the substrate to an outer side of the substrate due to a rotation of the substrate supported by the support unit, and the air flow guide duct having an inlet into which an air flow is introduced, the inlet provided at a substantially same level with the substrate supported by the support unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.