Patent · US Active

Control method and plasma processing apparatus

US11658012B2 · kind B2 · utility

0Cited by
1References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 2020
Grant dateMay 23, 2023
Priority date
Expiry dateJun 21, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/334
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A control method includes: (a) connecting a power supply to an electrode of an electrostatic chuck inside a chamber and applying a voltage from the power supply to the electrode; (b) after (a), switching a connection between the electrode and the power supply to a non-connection state; (c) after (b), supplying a gas into the chamber to generate plasma; and (d) measuring a potential of the electrode during (c).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.