Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer

US11658022B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Axel Beyer · Munich, DE
• Christof Weber · Burghausen, DE
• Stefan WELSCH · Polling, DE

Key dates

• Filing date: Jun 4, 2018
• Grant date: May 23, 2023
• Expiry date: Jul 7, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02019
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method of processing a semiconductor in the semiconductor wafer is disposed on a susceptor in a coating apparatus and processed, wherein an etching gas is passed through the coating apparatus in an etching step. The invention further relates to a control system for controlling a coating apparatus for processing a semiconductor water, to a plant for processing a semiconductor wafer having a coating apparatus which comprises the control system, and a semiconductor wafer. A first side of the semiconductor wafer which has been subjected to a polishing operation by CMP, or a second side of the semiconductor wafer opposite the first side, is coated with a protective layer before processing.