Axel Beyer
6Patents
1h-index
7Co-inventors
36Inventor score
Filing activity: Jun 4, 2018 → Jan 23, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12083705B2 | Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon | Emerging Cross-Sectional Technologies | 1 | Active |
| US11658022B2 | Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer | Electricity | 0 | Active |
| US12311455B2 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Performing Operations; Transporting | 0 | Active |
| US12381074B2 | Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer | Electricity | 0 | Active |
| US12325081B2 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Performing Operations; Transporting | 0 | Active |
| US11158549B2 | Method, control system and plant for processing a semiconductor wafer, and semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.