Sub-field control of a lithographic process and associated apparatus
US11662666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Mar 5, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70725
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.