Systems and methods for orientator based wafer defect sensing
US11664260B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 9, 2021 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jul 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In an embodiment, a system includes: an orientation sensor configured to detect an orientation fiducial on a bevel of a wafer; a pedestal configured to rotate the wafer to allow the orientation sensor to detect the orientation fiducial and place the orientation fiducial at a predetermined orientation position; and a defect sensor configured to detect a wafer defect along a surface of the wafer while rotated by the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.