Patent · US Active

Semiconductor module

US11664304B2 · kind B2 · utility

0Cited by

0References

19Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Sergey Yuferev · Villach, AT
Robert Fehler · Regensburg, DE
Angela Kessler · Regensburg, DE
Gerhard Noebauer · Villach, AT
Petteri Palm · Regensburg, DE

Key dates

Filing date	Oct 5, 2021
Grant date	May 30, 2023
Priority date	—
Expiry date	Nov 25, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L25/165
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module is provided that includes a low side switch, a high side switch and a control chip. The low side switch and the high side switch are arranged laterally adjacent one another and coupled by a switch node connector to form a half bridge circuit. The switch node connector includes two or more branches that have an arrangement with respect to the low side switch and to the high side switch and that each have a cross-sectional area. The arrangement and the cross-sectional area of the two or more branches are selected so as to homogenise the current density distribution within the switch node connector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.