Method of manufacturing die seal ring
US11664333B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Nov 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a die seal ring including the following steps is provided. A dielectric layer is formed on a substrate. Conductive layers stacked on the substrate are formed in the dielectric layer. Each of the conductive layers includes a first conductive portion and a second conductive portion. The second conductive portion is disposed on the first conductive portion. A width of the first conductive portion is smaller than a width of the second conductive portion. A first air gap is formed between a sidewall of the first conductive portion and the dielectric layer. A second air gap is formed between a sidewall of the second conductive portion and the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.