Inventor · Guoxing Township, TW

Ching-Li Yang

18Patents
4h-index
33Co-inventors
56Inventor score

Filing activity: Dec 17, 2006 → May 2, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8916471B1 Method for forming semiconductor structure having through silicon via for signal and shielding structure Electricity 20 Active
US7387950B1 Method for forming a metal structure Electricity 19 Active
US8518823B2 Through silicon via and method of forming the same Electricity 11 Active
US9012324B2 Through silicon via process Electricity 8 Active
US8841755B2 Through silicon via and method of forming the same Electricity 3 Active
US8884398B2 Anti-fuse structure and programming method thereof Electricity 2 Active
US7649268B2 Semiconductor wafer Electricity 2 Active
US8900996B2 Through silicon via structure and method of fabricating the same Electricity 2 Active
US9048246B2 Die seal ring and method of forming the same Electricity 1 Active
US9312208B2 Through silicon via structure Electricity 1 Active
US10978391B2 Connection structure of semiconductor device and manufacturing method thereof Electricity 1 Active
US12315827B2 Semiconductor structure including seal ring structure Electricity 0 Active
US10892235B2 Die seal ring and manufacturing method thereof Electricity 0 Active
US7696606B2 Metal structure Electricity 0 Active
US11916018B2 Manufacturing method of connection structure of semiconductor device Electricity 0 Active
US11664333B2 Method of manufacturing die seal ring Electricity 0 Active
US9773860B1 Capacitor and method for fabricating the same Electricity 0 Active
US8691688B2 Method of manufacturing semiconductor structure Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.