Semiconductor wafer measurement method and system
US11669957B2 · kind B2 · utility
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Key dates
| Filing date | Jul 16, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of analyzing a semiconductor wafer includes obtaining a graphic data system (GDS) file corresponding to the semiconductor wafer, using GDS information from the GDS file to provide coordinates of a layout feature of the semiconductor wafer to an electron microscope, using the electron microscope to capture a raw image from the semiconductor wafer based on the coordinates of the layout feature, and performing a measurement operation on the raw image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.