System and method for controlling electrostatic clamping of multiple platens on a spinning disk
US11670532B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Dec 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20214
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.