Method for depositing molybdenum layers using an underlayer
US11674220B2 · kind B2 · utility
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2,211References
18Claims
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Key dates
| Filing date | Jul 15, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Jul 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C28/341
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for forming molybdenum layers on a surface of a substrate and structures and devices formed using the methods are disclosed. Exemplary methods include forming an underlayer prior to forming the molybdenum layer. The underlayer can be used to manipulate stress in the molybdenum layer and/or reduce a nucleation temperature and/or deposition temperature of a step of forming the molybdenum layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.