Compliant wafer probe assembly

US11675010B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David M. Audette · Webster, US
• Grant Wagner · Jericho, US
• Jacob Louis Moore · Checkerberry Village, US
• Peter W. Neff · Stowe, US

Key dates

• Filing date: Nov 30, 2021
• Grant date: Jun 13, 2023
• Expiry date: Nov 30, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2889
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.