Substrate processing apparatus and control method of substrate processing apparatus
US11676800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Apr 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32935
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a substrate stage on which a substrate is disposed, a first radio-frequency power supply configured to supply first radio-frequency power having a first frequency to the substrate stage, an impedance converter configured to convert an impedance on a load side seen from the first radio-frequency power supply into a set impedance, a second radio-frequency power supply configured to supply second radio-frequency power having a second frequency lower than the first frequency to the substrate stage, and a controller configured to control the set impedance of the impedance converter, and the controller sets the set impedance according to a substrate processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.