Nanoparticle backside die adhesion layer
US11676930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.