Patent · US Active

Selective deposition on non-metallic surfaces

US11680313B2 · kind B2 · utility

1Cited by

2References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Sang Ho Yu · Cupertino, US
Lu Chen · Sunnyvale, US
Seshadri Ganguli · Sunnyvale, US

Key dates

Filing date	May 5, 2020
Grant date	Jun 20, 2023
Priority date	—
Expiry date	Feb 17, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/53238
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods for selectively depositing on non-metallic surfaces are disclosed. Some embodiments of the disclosure utilize an unsaturated hydrocarbon to form a blocking layer on metallic surfaces. Deposition is performed to selectively deposit on the unblocked non-metallic surfaces. Some embodiments of the disclosure relate to methods of forming metallic vias with decreased resistance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.