Patent · US Active

Enhanced EUV photoresist materials, formulations and processes

US11681227B2 · kind B2 · utility

0Cited by
6References
7Claims
0Family size

Inventors

Key dates

Filing dateFeb 25, 2019
Grant dateJun 20, 2023
Priority date
Expiry dateApr 13, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/70033
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The present disclosure relates to novel negative-type photoresist composition and methods of their use. The disclosure further relates to multiple trigger photoresist processes which allow for the improvement in contrast, resolution, and/or line edges roughness in some systems without giving up sensitivity. The photoresist compositions and the methods of the current disclosure are ideal for fine patent processing using, for example, ultraviolet radiation, extreme ultraviolet radiation, beyond extreme ultraviolet radiation, X-rays and changed particle. The disclosure further relates to sensitivity enhancing materials useful in the disclosed compositions and methods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.