Planarized membrane and methods for substrate processing systems
US11685012B2 · kind B2 · utility
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4References
26Claims
0Family size
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Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Nov 8, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in chemical mechanical planarization of a wafer. The method further includes finishing the surface of a wafer with the planarized membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.