Inventor · Phoenix, AZ, US

Daniel Ray Trojan

17Patents
5h-index
13Co-inventors
63Inventor score

Filing activity: Jul 25, 1997 → Jan 12, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US5899798A Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing Performing Operations; Transporting 52 Expired
US6116990A Adjustable low profile gimbal system for chemical mechanical polishing Performing Operations; Transporting 18 Expired
US6368183B1 Wafer cleaning apparatus and associated wafer processing methods Emerging Cross-Sectional Technologies 17 Expired
US6923711B2 Multizone carrier with process monitoring system for chemical-mechanical planarization tool Electricity 15 Expired
US7540799B1 System for adjusting an end effector relative to a workpiece Performing Operations; Transporting 6 Active
US6125861A Post-CMP wet-HF cleaning station Emerging Cross-Sectional Technologies 4 Expired
US11904431B2 Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing Electricity 1 Active
US12145236B2 Containment and exhaust system for substrate polishing components Performing Operations; Transporting 0 Active
US11685012B2 Planarized membrane and methods for substrate processing systems Chemistry; Metallurgy 0 Active
US12217979B2 Temperature controlled substrate carrier and polishing components Electricity 0 Active
US10315286B2 Chemical mechanical planarization carrier system Performing Operations; Transporting 0 Active
US8944887B2 Apparatus and method for surface grinding and edge trimming workpieces Performing Operations; Transporting 0 Active
US12023778B2 Substrate carrier head and processing system Performing Operations; Transporting 0 Active
US12198935B2 Atmospheric plasma in wafer processing system optimization Electricity 0 Active
US9390903B2 Method and apparatus for wafer backgrinding and edge trimming on one machine Electricity 0 Active
US11376705B2 Chemical mechanical planarization carrier system Performing Operations; Transporting 0 Active
US12377520B2 Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.