Method for automated critical dimension measurement on a substrate for display manufacturing, method of inspecting a large area substrate for display manufacturing, apparatus for inspecting a large area substrate for display manufacturing and method of operating thereof

US11687008B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Bernhard Mueller · Finsing, DE
• Robert Trauner · Pliening, DE
• Bernhard Schuler · Austin, US
• Peter C. Staffansson · Weiling, DE
• Kulpreet Singh VIRDI · Munich, DE
• Volker Daiker · Weiling, DE

Key dates

• Filing date: Feb 22, 2018
• Grant date: Jun 27, 2023
• Expiry date: Mar 9, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/24592
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

According to an embodiment, a method for automated critical dimension measurement on a substrate for display manufacturing is provided. The method includes scanning a first field of view having a first size with a charged particle beam to obtain a first image having a first resolution of a first portion of the substrate for display manufacturing; determining a pattern within the first image, the pattern having a first position; scanning a second field of view with the charged particle beam to obtain a second image of a second portion of the substrate, the second field of view has a second size smaller than the first size and has a second position provided relative to the first position, the second image has a second resolution higher than the first resolution; and determining a critical dimension of a structure provided on the substrate from the second image.