Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film
US11692066B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | May 17, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/094
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, noting that in the general formula (1A), when W1 represents any of R1 does not represent any of
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.