Substrate support assemblies and components

US11699602B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jian Li · Fremont, US
• Edward P. Hammond, IV · Hillsborough, US
• Viren Kalsekar · Sunnyvale, US
• Vidyadharan Srinivasa Murthy Bangalore · Bengaluru, IN
• Juan Carlos Rocha-Alvarez · Redwood City, US

Key dates

• Filing date: Jul 7, 2020
• Grant date: Jul 11, 2023
• Expiry date: Jul 7, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68792
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Exemplary substrate support assemblies may include a platen characterized by a first surface configured to support a semiconductor substrate. The assemblies may include a first stem section coupled with a second surface of the platen opposite the first surface of the platen. The assemblies may include a second stem section coupled with the first stem section. The second stem section may include a housing and a rod holder disposed within the housing. The second stem section may include a connector seated within the rod holder at a first end of the connector. The second stem section may include a heater rod disposed within the first end of the connector and a heater extension rod coupled with the connector at a second end of the connector. The second stem section may include an RF rod and an RF strap coupling the RF rod with an RF extension rod.